Integrated circuit package system with anti-peel contact pads

Integrated circuit package system with anti-peel contact pads

An integrated circuit package system includes: forming an anti-peel pad having both a concave ring and an external terminal with the concave ring, having a peripheral wall, surrounding the external terminal; connecting an integrated circuit with the anti-peel pad; and forming an encapsulation over t...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: BATHAN HENRY DESCALZO, CAMACHO ZIGMUND RAMIREZ, PISIGAN JAIRUS LEGASPI
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:An integrated circuit package system includes: forming an anti-peel pad having both a concave ring and an external terminal with the concave ring, having a peripheral wall, surrounding the external terminal; connecting an integrated circuit with the anti-peel pad; and forming an encapsulation over the integrated circuit, the concave ring, and the external terminal with the encapsulation under the peripheral wall.