Solid state light fixture with cooling system with heat rejection management

Systems and methods for solid-state light source heat management are provided. A solid-state light source, e.g. having one or more LEDs, can be mounted within an enclosure. In some embodiments, a heat sink associated with semiconductor material and/or power electronics can be placed on a separate si...

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Bibliographische Detailangaben
Hauptverfasser:	CROOKHAM JOE P, GORDIN MYRON
Format:	Patent
Sprache:	eng
Schlagworte:	AIR-CONDITIONING, AIR-HUMIDIFICATION, VENTILATION, USE OF AIRCURRENTS FOR SCREENING BLASTING CALCULATING COMPUTING COUNTING ELECTRIC DIGITAL DATA PROCESSING FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMSTHEREOF HEATING INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21Sand F21V, RELATING TO THEFORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THELIGHT EMITTED INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21Sand F21V, RELATING TO USESOR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS INFORMATION AND COMMUNICATION TECHNOLOGY [ICT] SPECIALLY ADAPTEDFOR SPECIFIC APPLICATION FIELDS LIGHTING MECHANICAL ENGINEERING PHYSICS RANGES STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHERARTICLES, NOT OTHERWISE PROVIDED FOR VENTILATING WEAPONS
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Beschreibung
Zusammenfassung:	Systems and methods for solid-state light source heat management are provided. A solid-state light source, e.g. having one or more LEDs, can be mounted within an enclosure. In some embodiments, a heat sink associated with semiconductor material and/or power electronics can be placed on a separate side of the enclosure that is thermally insulated or separated from the state-light source. The enclosure can include a first side or portion that allows light from the solid-state-light source (e.g., LEDs) to pass through to a target area. A fluid transfer conduit may be connected to the second side or portion of the enclosure for passing a fluid (e.g., air, water, coolant, etc.) across the heat sink to transport heat generated by the power electronics and/or semiconductor material away. The heated fluid can then be routed to, as examples, an HVAC system, a vent, water heating systems, heat exchanger systems, and/or storage systems (e.g., batteries).