Inkjet recording head and method of manufacturing inkjet recording head

An inkjet recording head includes: plural element substrates from which ink is ejected; and a flexible wiring substrate which includes a first wiring area, a second wiring area and a bending portion, the first wiring area including plural openings in which the element substrates are placed and which...

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Bibliographische Detailangaben
1. Verfasser:	SAIKAWA HIDEO
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CORRECTION OF TYPOGRAPHICAL ERRORS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME LINING MACHINES MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PERFORMING OPERATIONS PRINTED CIRCUITS PRINTING SELECTIVE PRINTING MECHANISMS STAMPS TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS TRANSPORTING TYPEWRITERS
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Beschreibung
Zusammenfassung:	An inkjet recording head includes: plural element substrates from which ink is ejected; and a flexible wiring substrate which includes a first wiring area, a second wiring area and a bending portion, the first wiring area including plural openings in which the element substrates are placed and which includes, in the periphery thereof, electrode terminals electrically connected to the element substrates, and the bending portion being bent between the first wiring area and the second wiring area. The flexible wiring substrate includes a slit which extends between the plural openings and reaches the bending portion or a position further than the bending portion from an end portion of the flexible wiring substrate on the side on which the first wiring area is provided, at a position opposite to the bending portion.