Method for fabrication of layered heterojunction polymeric devices

Method for growing multilayer polymer based hetexjunction devices which uses selective breaking of C-H or Si-H bonds without breaking other bonds leading to fast curing for the production of layered polymer devices having polymer heterojunctions deposited by the common solution-based deposition meth...

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Bibliographische Detailangaben
Hauptverfasser:	NIE HENG YONG, LAU LEO W. M, TREBICKY TOMAS
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CHEMISTRY COMPOSITIONS BASED THEREON ELECTRICITY GENERAL PROCESSES OF COMPOUNDING METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP WORKING-UP
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Beschreibung
Zusammenfassung:	Method for growing multilayer polymer based hetexjunction devices which uses selective breaking of C-H or Si-H bonds without breaking other bonds leading to fast curing for the production of layered polymer devices having polymer heterojunctions deposited by the common solution-based deposition methods.