Process for producing substrate provided with metal pattern and substrate provided with metal laminate

The present invention relates to a process for producing a substrate provided with a metal pattern by forming a pattern of a metal layer on a substrate using a laser light, the process including: a step of preparing a substrate in which the metal layer is formed on a surface thereof; a step of formi...

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Bibliographische Detailangaben
1. Verfasser:	NIU GUANGYAO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PRINTED CIRCUITS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	The present invention relates to a process for producing a substrate provided with a metal pattern by forming a pattern of a metal layer on a substrate using a laser light, the process including: a step of preparing a substrate in which the metal layer is formed on a surface thereof; a step of forming on the metal layer an assist layer which comprises a metal material different from that of the metal layer and which has a light absorptivity for the laser light different from that of the metal layer, thereby forming a metal laminate on the substrate; and a step of patterning the metal layer by irradiating the metal laminate with the laser light to remove a laser light-irradiated portion of the metal laminate, thereby forming a metal pattern on the substrate.