Semiconductor packages and electronic systems including the same

A plurality of semiconductor chips may be stacked on the substrate, and each of them may include at least one electrode pad. At least one of the plurality of semiconductor chips may include at least one redistribution pad configured to electrically connect with the at least one electrode pad.

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Hauptverfasser:	YOUN SUNPIL, KIM HYE-JIN, KIM BYUNG-SEO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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creator	YOUN SUNPIL KIM HYE-JIN KIM BYUNG-SEO
description	A plurality of semiconductor chips may be stacked on the substrate, and each of them may include at least one electrode pad. At least one of the plurality of semiconductor chips may include at least one redistribution pad configured to electrically connect with the at least one electrode pad.
format	Patent
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title	Semiconductor packages and electronic systems including the same
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