Semiconductor packages and electronic systems including the same

A plurality of semiconductor chips may be stacked on the substrate, and each of them may include at least one electrode pad. At least one of the plurality of semiconductor chips may include at least one redistribution pad configured to electrically connect with the at least one electrode pad.

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Bibliographische Detailangaben
Hauptverfasser: YOUN SUNPIL, KIM HYE-JIN, KIM BYUNG-SEO
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:A plurality of semiconductor chips may be stacked on the substrate, and each of them may include at least one electrode pad. At least one of the plurality of semiconductor chips may include at least one redistribution pad configured to electrically connect with the at least one electrode pad.