Electrical interconnect using embossed contacts on a flex circuit

Electrical interconnect using embossed contacts on a flex circuit

A print head has a jet stack having an array of jets, an array of transducers arranged on the jet stack such that each transducer corresponds to a jet in the array of jets, and a flexible circuit substrate arranged adjacent the array of transducers such that contact pads on the flexible circuit subs...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: ANDREWS JOHN R, LAHARTY CHRISTOPHER J, STEPHENS TERRANCE L, MASSOPUST DAN LEO
Format: Patent
Sprache:eng
Schlagworte:
CORRECTION OF TYPOGRAPHICAL ERRORS
i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME
LINING MACHINES
PERFORMING OPERATIONS
PRINTING
SELECTIVE PRINTING MECHANISMS
STAMPS
TRANSPORTING
TYPEWRITERS
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Beschreibung
Zusammenfassung:A print head has a jet stack having an array of jets, an array of transducers arranged on the jet stack such that each transducer corresponds to a jet in the array of jets, and a flexible circuit substrate arranged adjacent the array of transducers such that contact pads on the flexible circuit substrate make electrical connection to at least some of the array of transducers, the flexible circuit substrate being embossed so that the contact pads extend out of a plane of the flexible circuit substrate.