Method for polishing aluminum/copper and titanium in damascene structures
The invention provides compositions and methods for planarizing or polishing a substrate. The composition comprises an abrasive consisting of alumina particles optionally treated with a polymer, an alpha-hydroxycarboxylic acid, an oxidizing agent that oxidizes at least one metal, polyacrylic acid, o...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | The invention provides compositions and methods for planarizing or polishing a substrate. The composition comprises an abrasive consisting of alumina particles optionally treated with a polymer, an alpha-hydroxycarboxylic acid, an oxidizing agent that oxidizes at least one metal, polyacrylic acid, optionally, a calcium-containing compound, optionally, a biocide, optionally, a pH adjusting agent, and water. The method uses the composition to chemically-mechanically polish a substrate. |
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