Method of making an electrical circuit structure

Method of making an electrical circuit structure

An electrical interconnect has an adhesive layer in which is formed an array of apertures, the apertures being of non-circular shape. An electrical circuit apparatus has a first circuit having at least one electrical contact, a second circuit having at least one electrical contact aligned to the ele...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: SLENES CHAD J, SCHMACHTENBERG, III RICHARD, ANDREWS JOHN R, GERNER BRADLEY J, SCHULTZ SAMUEL, BRICK JONATHAN R
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC INCANDESCENT LAMPS
ELECTRICITY
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Beschreibung
Zusammenfassung:An electrical interconnect has an adhesive layer in which is formed an array of apertures, the apertures being of non-circular shape. An electrical circuit apparatus has a first circuit having at least one electrical contact, a second circuit having at least one electrical contact aligned to the electrical contact of the first circuit, and a standoff structure between the first and second circuits having at least one aperture aligned to one electrical contact of the first and second circuits, the aperture being of a non-circular shape.