Semiconductor devices having lower and upper interconnection structures that exhibit reduced coupling

An interconnection structure for a semiconductor device may include lower interconnection patterns disposed in a checker board shape and upper interconnection patterns disposed in a checker board shape and connecting two adjacent lower interconnection patterns to each other.

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Bibliographische Detailangaben
Hauptverfasser: KIM TACKYUNG, KIM JUN-SEOK, YOON JOONG-HO, ROH KANG-SUP, LEE EUN-JUNG
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:An interconnection structure for a semiconductor device may include lower interconnection patterns disposed in a checker board shape and upper interconnection patterns disposed in a checker board shape and connecting two adjacent lower interconnection patterns to each other.