Method of fabricating semiconductor device comprising a dummy well

Provided are a semiconductor device and a method of fabricating the semiconductor device. The semiconductor device can include first transistors that include a first gate insulating layer having a first thickness and second transistors include a second gate insulating layer having a second thickness...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: LEE WOON-KYUNG, OH DONGYEAN
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator LEE WOON-KYUNG
OH DONGYEAN
description Provided are a semiconductor device and a method of fabricating the semiconductor device. The semiconductor device can include first transistors that include a first gate insulating layer having a first thickness and second transistors include a second gate insulating layer having a second thickness less than the first thickness. At least one of the transistors formed on the first or second gate insulating layers is directly over a dummy well.
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US8609496B2</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US8609496B2</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US8609496B23</originalsourceid><addsrcrecordid>eNrjZHDyTS3JyE9RyE9TSEtMKspMTizJzEtXKE7NzUzOz0spTS7JL1JISS3LTE5VSM7PLSjKLAbJJyqklObmViqUp-bk8DCwpiXmFKfyQmluBgU31xBnD93Ugvz41OKCxOTUvNSS-NBgCzMDSxNLMycjYyKUAAAAdTIq</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Method of fabricating semiconductor device comprising a dummy well</title><source>esp@cenet</source><creator>LEE WOON-KYUNG ; OH DONGYEAN</creator><creatorcontrib>LEE WOON-KYUNG ; OH DONGYEAN</creatorcontrib><description>Provided are a semiconductor device and a method of fabricating the semiconductor device. The semiconductor device can include first transistors that include a first gate insulating layer having a first thickness and second transistors include a second gate insulating layer having a second thickness less than the first thickness. At least one of the transistors formed on the first or second gate insulating layers is directly over a dummy well.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2013</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20131217&amp;DB=EPODOC&amp;CC=US&amp;NR=8609496B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76419</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20131217&amp;DB=EPODOC&amp;CC=US&amp;NR=8609496B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>LEE WOON-KYUNG</creatorcontrib><creatorcontrib>OH DONGYEAN</creatorcontrib><title>Method of fabricating semiconductor device comprising a dummy well</title><description>Provided are a semiconductor device and a method of fabricating the semiconductor device. The semiconductor device can include first transistors that include a first gate insulating layer having a first thickness and second transistors include a second gate insulating layer having a second thickness less than the first thickness. At least one of the transistors formed on the first or second gate insulating layers is directly over a dummy well.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2013</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHDyTS3JyE9RyE9TSEtMKspMTizJzEtXKE7NzUzOz0spTS7JL1JISS3LTE5VSM7PLSjKLAbJJyqklObmViqUp-bk8DCwpiXmFKfyQmluBgU31xBnD93Ugvz41OKCxOTUvNSS-NBgCzMDSxNLMycjYyKUAAAAdTIq</recordid><startdate>20131217</startdate><enddate>20131217</enddate><creator>LEE WOON-KYUNG</creator><creator>OH DONGYEAN</creator><scope>EVB</scope></search><sort><creationdate>20131217</creationdate><title>Method of fabricating semiconductor device comprising a dummy well</title><author>LEE WOON-KYUNG ; OH DONGYEAN</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US8609496B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2013</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>LEE WOON-KYUNG</creatorcontrib><creatorcontrib>OH DONGYEAN</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>LEE WOON-KYUNG</au><au>OH DONGYEAN</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Method of fabricating semiconductor device comprising a dummy well</title><date>2013-12-17</date><risdate>2013</risdate><abstract>Provided are a semiconductor device and a method of fabricating the semiconductor device. The semiconductor device can include first transistors that include a first gate insulating layer having a first thickness and second transistors include a second gate insulating layer having a second thickness less than the first thickness. At least one of the transistors formed on the first or second gate insulating layers is directly over a dummy well.</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng
recordid cdi_epo_espacenet_US8609496B2
source esp@cenet
subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Method of fabricating semiconductor device comprising a dummy well
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-08T00%3A35%3A56IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=LEE%20WOON-KYUNG&rft.date=2013-12-17&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS8609496B2%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true