Method of fabricating semiconductor device comprising a dummy well

Provided are a semiconductor device and a method of fabricating the semiconductor device. The semiconductor device can include first transistors that include a first gate insulating layer having a first thickness and second transistors include a second gate insulating layer having a second thickness...

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Bibliographische Detailangaben
Hauptverfasser: LEE WOON-KYUNG, OH DONGYEAN
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:Provided are a semiconductor device and a method of fabricating the semiconductor device. The semiconductor device can include first transistors that include a first gate insulating layer having a first thickness and second transistors include a second gate insulating layer having a second thickness less than the first thickness. At least one of the transistors formed on the first or second gate insulating layers is directly over a dummy well.