Nickel-gold plateable thick film silver paste

Described are LTCC devices, with external silver containing electrical contacts, that are sequentially plated with a nickel containing metal and a gold containing metal, with a defined silver paste composition for manufacture.

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Bibliographische Detailangaben
Hauptverfasser: VOULTOS JOHN D, NAIR KUMARAN MANIKANTAN, SKURSKI MICHAEL A
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:Described are LTCC devices, with external silver containing electrical contacts, that are sequentially plated with a nickel containing metal and a gold containing metal, with a defined silver paste composition for manufacture.