Nickel-gold plateable thick film silver paste
Described are LTCC devices, with external silver containing electrical contacts, that are sequentially plated with a nickel containing metal and a gold containing metal, with a defined silver paste composition for manufacture.
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Format: | Patent |
Sprache: | eng |
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Zusammenfassung: | Described are LTCC devices, with external silver containing electrical contacts, that are sequentially plated with a nickel containing metal and a gold containing metal, with a defined silver paste composition for manufacture. |
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