Cooling apparatus and electronic equipment

A cooling apparatus that cools first and second high density heat dissipation components provided in a housing including a fan that provide an air convection from one opening toward the other opening, the cooling apparatus having: a conduit that contacts the first heat dissipation component and that...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: TAKEMURA KEIZOU, WEI JIE, KATSUMATA KENJI
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:A cooling apparatus that cools first and second high density heat dissipation components provided in a housing including a fan that provide an air convection from one opening toward the other opening, the cooling apparatus having: a conduit that contacts the first heat dissipation component and that allows a coolant to pass there through; and a fin structure that contacts the conduit and that is provided on an upwind side of the second heat dissipation component.