Semiconductor dice with backside trenches filled with elastic material for improved attachment, packages using the same, and methods of making the same

Semiconductor dice with backside trenches filled with elastic material for improved attachment, packages using the same, and methods of making the same

Disclosed are semiconductor dice with backside trenches filled with elastic conductive material. The trenches reduce the on-state resistances of the devices incorporated on the dice. The elastic conductive material provides a conductive path to the backsides of the die with little induced stress on...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: GRUENHAGEN MICHAEL D, TJHIA EDDY, DOLAN DOUGLAS E, MURPHY JAMES J, WU CHUNG-LIN, KIM SUKU, LARSEN MARK
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:Disclosed are semiconductor dice with backside trenches filled with elastic conductive material. The trenches reduce the on-state resistances of the devices incorporated on the dice. The elastic conductive material provides a conductive path to the backsides of the die with little induced stress on the semiconductor die caused by thermal cycling. Also disclosed are packages using the dice, and methods of making the dice.