Integrated circuit package system with lead-frame paddle scheme for single axis partial saw isolation

Integrated circuit package system with lead-frame paddle scheme for single axis partial saw isolation

An integrated circuit package system includes: providing a die-pad with a predefined slot and an integrated circuit attached to the die-pad; connecting the integrated circuit to the die-pad with a bond wire; encapsulating the integrated circuit and the bond wire with an encapsulation; and partitioni...

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Bibliographische Detailangaben
Hauptverfasser: BATHAN HENRY DESCALZO, SHIM IL KWON, CAMACHO ZIGMUND RAMIREZ, CAPARAS JOSE ALVIN, CABLAO PHILIP LYNDON
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:An integrated circuit package system includes: providing a die-pad with a predefined slot and an integrated circuit attached to the die-pad; connecting the integrated circuit to the die-pad with a bond wire; encapsulating the integrated circuit and the bond wire with an encapsulation; and partitioning the die-pad with partial saw isolation grooves along a single axis, and into a side pad, and a die attach pad.