Pre-patterned layup kit and method of manufacture

A pre-patterned layup kit with layup patterned to accommodate an airframe topological feature, trimmed to fit a preselected target region of a layup structure, and conformed to the target region contour. The kit can be fabricated in advance of airframe manufacture and stored until use. The kit includes a flexible carrier upon which the layup is laid, and a release layer between the layup and the carrier. The layup has multiple laminae oriented to an carrier indexing element, and indexed to the target region thereby. A kit manufacturing method includes preparing the laminae constituent of the layup, preparing the carrier, and laying down the laminae on the carrier to make the kit. The kit can be compacted, inspected, and prepared for storage. The layup can be fabricated of a pre-patterned lamina or multiple laminae that are shaped and trimmed to accommodate an airframe topological feature.