Stacked semiconductor device and manufacturing method thereof

In an embodiment, a first semiconductor wafer having plural first chip areas sectioned by first dicing grooves, and first photosensitive surface protection and adhesive layers provided at each of circuit surfaces of the plural first chip areas is prepared. A second semiconductor wafer having plural...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	OMIZO SHOKO, IWAMI FUMIHIRO, YOSHIMURA ATSUSHI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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