Light-emitting element package and fabrication method thereof

Light-emitting element package and fabrication method thereof

A light-emitting element package includes a package member for encapsulating a light-emitting element. A plurality of photonic crystal patterns is formed on the package member. A distribution density of the photonic crystal patterns corresponds to light distribution of the light-emitting element. Ea...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: HSIEH MIN-TSUN, LIN CHIH-YUNG, LIAO CHI-WEI, CHEN LUNG-HSIN, YEH CHING-LIEN, TSENG WEN-LIANG
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A light-emitting element package includes a package member for encapsulating a light-emitting element. A plurality of photonic crystal patterns is formed on the package member. A distribution density of the photonic crystal patterns corresponds to light distribution of the light-emitting element. Each photonic crystal pattern consists of a plurality of photonic crystals.