Electrical insulating resin composition, and laminate for circuit board

Provided is an electrical insulating resin composition capable of forming an electrical insulating layer which has excellent flexibility and board adhesiveness, together with high thermal resistance and high humidity resistance, tolerates a high temperature treatment at soldering and can be stably used for a long time under a harsh environment with high temperature and vibration in an automobile. A resin composition containing as organic components at least a rubber like polymer compound (A) composed of a copolymer of an aromatic vinyl compound and a conjugated diene compound and a polymerizable monomer (B) having one or more terminal reactive double bonds is employed as the electrical insulating resin composition. The compound (A) may be partially hydrogenated. The composition may optionally contain an oligomer (C) having a ring structure and having a reactive unsaturated bond in the molecule thereof.