System and method for in situ monitoring of top wafer thickness in a stack of wafers

System and method for in situ monitoring of top wafer thickness in a stack of wafers

A system for holding non-contact wafer probes over the surface of a wafer which includes a system for flushing the surface of the probe during grinding.

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Bibliographische Detailangaben
Hauptverfasser: SMEDLEY BENJAMIN C, SCHRAUB FREDERIC ANTHONY, VOGTMANN MICHAEL R
Format: Patent
Sprache:eng
Schlagworte:
MEASURING
MEASURING ANGLES
MEASURING AREAS
MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS
PHYSICS
TESTING
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Beschreibung
Zusammenfassung:A system for holding non-contact wafer probes over the surface of a wafer which includes a system for flushing the surface of the probe during grinding.