Slurry system for semiconductor fabrication

A slurry feed system suitable for chemical mechanical planarization (CMP) processes in a semiconductor fabrication facility and related method. The slurry feed system includes a valve manifold box having a discharge piping header fluidly connected to at least one CMP station and a first slurry suppl...

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Bibliographische Detailangaben
Hauptverfasser:	CHEN YUNG-LONG, TSENG CHIHIANG, HUANG LIANGIEH, HUANG YI-WEN
Format:	Patent
Sprache:	eng
Schlagworte:	DRESSING OR CONDITIONING OF ABRADING SURFACES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING MEASURING MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUIDLEVEL METERING BY VOLUME MIXING, e.g. DISSOLVING, EMULSIFYING, DISPERSING PERFORMING OPERATIONS PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL PHYSICS POLISHING TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS TESTING TRANSPORTING
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Beschreibung
Zusammenfassung:	A slurry feed system suitable for chemical mechanical planarization (CMP) processes in a semiconductor fabrication facility and related method. The slurry feed system includes a valve manifold box having a discharge piping header fluidly connected to at least one CMP station and a first slurry supply train. The first slurry supply train may include a slurry mixing tank, day tank, and at least two slurry feed pumps arranged in series pumping relationship. The first slurry supply train defines a first slurry piping loop. In one embodiment, a second slurry supply train defining a second slurry piping loop is provided. The valve manifold box is operable to supply slurry from either or both of the first and second slurry piping loops to the CMP station.