Methods and systems for forming slots in a semiconductor substrate

A method of fabricating a fluid feed slot in a print head substrate includes making a cut into a first surface of a substrate using a cutting disk having a generally planar surface oriented generally perpendicular to the first surface, and removing material from a second surface of the substrate. Ma...

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Bibliographische Detailangaben
Hauptverfasser: KHAVARL MAHRGAN, TEMPLIN PAUL, BUSWELL SHEN, MACKENZLE MARK H, RIVAS RIO T, JENSSEN CONRAD
Format: Patent
Sprache:eng
Schlagworte:
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Zusammenfassung:A method of fabricating a fluid feed slot in a print head substrate includes making a cut into a first surface of a substrate using a cutting disk having a generally planar surface oriented generally perpendicular to the first surface, and removing material from a second surface of the substrate. Making the cut and removing the material form, in combination, the fluid feed slot in the substrate at least a portion of which passes entirely through the substrate, with a full length of the fluid feed slot extending less than a full length of the substrate, and making the cut into the first surface includes providing a first completed portion of the fluid feed slot with curved surfaces at opposite end walls thereof converging from the first surface toward the second surface.