Substrate with embedded patterned capacitance

A process for forming a laminate with capacitance and the laminate formed thereby. The process includes the steps of providing a substrate and laminating a conductive foil on the substrate wherein the foil has a dielectric. A conductive layer is formed on the dielectric. The conductive foil is treat...

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Bibliographische Detailangaben
Hauptverfasser: PRYMAK JOHN D, CHACKO ANTONY P, STOLARSKI CHRIS, DUNN GREGORY J, MELODY ALETHIA
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:A process for forming a laminate with capacitance and the laminate formed thereby. The process includes the steps of providing a substrate and laminating a conductive foil on the substrate wherein the foil has a dielectric. A conductive layer is formed on the dielectric. The conductive foil is treated to electrically isolate a region of conductive foil containing the conductive layer from additional conductive foil. A cathodic conductive couple is made between the conductive layer and a cathode trace and an anodic conductive couple is made between the conductive foil and an anode trace.