Stackable multi-chip package system

A stackable multi-chip package system is provided including forming a first external interconnect having a first through hole and a second external interconnect having a second through hole, forming a first package subassembly having the first external interconnect and a first integrated circuit die...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	YEE JAE HAK, LEE KOO HONG
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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