Die mounting assembly formed of dissimilar materials

A mounting assembly for a microelectronic device, the mounting assembly includes (a) a first member formed of a first material having a first coefficient of thermal expansion, the first member including i) a mounting surface for the microelectronic device; ii) a wall that adjoins the mounting surfac...

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Bibliographische Detailangaben
Hauptverfasser:	CIMINELLI MARIO J, PETRUCHIK DWIGHT J
Format:	Patent
Sprache:	eng
Schlagworte:	CORRECTION OF TYPOGRAPHICAL ERRORS i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME LINING MACHINES PERFORMING OPERATIONS PRINTING SELECTIVE PRINTING MECHANISMS STAMPS TRANSPORTING TYPEWRITERS
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Beschreibung
Zusammenfassung:	A mounting assembly for a microelectronic device, the mounting assembly includes (a) a first member formed of a first material having a first coefficient of thermal expansion, the first member including i) a mounting surface for the microelectronic device; ii) a wall that adjoins the mounting surface and that is recessed from the mounting surface; and iii) an extension of the mounting surface that extends beyond an end of the wall; and (b) a second member formed of a plastic material having a second coefficient of thermal expansion that is larger than the first coefficient of thermal expansion, wherein a first portion of the second member is attached to the extension.