Apparatus and method for intricate cuts

Certain embodiments disclosed herein relate to apparatuses and methods for intricate cuts. In particular, in one embodiment, a cutting apparatus is provided. The cutting apparatus includes a base member and an elongate member extending from the base member. The elongate member includes a tapered reg...

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Bibliographische Detailangaben
1. Verfasser:	KENNEY KEVIN M
Format:	Patent
Sprache:	eng
Schlagworte:	DRESSING OR CONDITIONING OF ABRADING SURFACES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS TRANSPORTING
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Beschreibung
Zusammenfassung:	Certain embodiments disclosed herein relate to apparatuses and methods for intricate cuts. In particular, in one embodiment, a cutting apparatus is provided. The cutting apparatus includes a base member and an elongate member extending from the base member. The elongate member includes a tapered region having an abrasive surface. The tapered region defines at least one vertex defining an angle of a desired cutout shape. Additionally, the tapered region is toothless.