Mold tooling with integrated thermal management fluid channels and method

An electroformed tooling device is disclosed. The device includes an electroformed tool with electrodeposited metal which has been plated from a structured substrate on a molding side to function as a molding surface and an uneven contour on a non-molding side of the electroformed tool left as a by-product of electroforming. The device also includes a blank base comprising a top surface, a network of thermal management channels, and at least a first opening and a second opening communicating with the network of thermal management channels to allow fluid to flow into the first opening and flow through the network of thermal management channels and flow out the second opening. The top surface further includes an electro-discharge machined contoured surface to mate with the uneven contour on the non-molding side of the electroformed tool. Fluid flowing through the thermal management channels cools or alternately cools and heats the electroformed tool.