Non-leaded integrated circuit package system
A non-leaded integrated circuit package system is provided providing a die paddle of a lead frame, forming a dual row of terminals including outer terminal pads and inner terminal pads, and selectively fusing an extension between the die paddle and instances of the inner terminal pads.
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | A non-leaded integrated circuit package system is provided providing a die paddle of a lead frame, forming a dual row of terminals including outer terminal pads and inner terminal pads, and selectively fusing an extension between the die paddle and instances of the inner terminal pads. |
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