Process of manufacturing low resistance damascene coils

In one embodiment and method of the present invention, a coil of a write head is created by forming a P1 pedestal layer and a back gap layer and further forming a coil pattern consistent with the coil to be formed and insulator spacers dispersed in the coil pattern, using a non-damascene process, th...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: LOO JENNIFER AI-MING, LEE EDWARD HIN PONG, ZHANG SUE SIYANG, NIKITIN VLADIMIR, BEDELL DANIEL WAYNE, DRUIST DAVID PATRICK
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:In one embodiment and method of the present invention, a coil of a write head is created by forming a P1 pedestal layer and a back gap layer and further forming a coil pattern consistent with the coil to be formed and insulator spacers dispersed in the coil pattern, using a non-damascene process, thereafter the coil is formed by plating using a damascene process.