Integrated circuit package system with heatspreader

An integrated circuit package system includes providing a substrate having an integrated circuit, attaching a heatspreader having a force control protrusion on the substrate, and forming an encapsulant over the heatspreader and the integrated circuit.

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Bibliographische Detailangaben
Hauptverfasser:	ILAGAN ALLAN, ESPIRITU EMMANUEL, CABLAO PHILIP LYNDON, FILOTEO, JR. DARIO S, ABINAN RACHEL LAYDA, MERILO LEO A
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	An integrated circuit package system includes providing a substrate having an integrated circuit, attaching a heatspreader having a force control protrusion on the substrate, and forming an encapsulant over the heatspreader and the integrated circuit.