Method for manufacturing liquid discharge head

A Method for manufacturing a liquid discharge head having a flow path forming member for forming a liquid flow path which communicates with a discharge port discharging liquid, comprises; preparing a layer containing a compound having a structure represented by Formula (1) and a structure represente...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	IKEDA MASUMI, HINO ETSUKO
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVEREDIN A SINGLE OTHER SUBCLASS BASIC ELECTRIC ELEMENTS CORRECTION OF TYPOGRAPHICAL ERRORS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME LINING MACHINES MEASURING MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PHYSICS PRINTING SELECTIVE PRINTING MECHANISMS SEMICONDUCTOR DEVICES SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS STAMPS TARIFF METERING APPARATUS TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS TESTING TRANSPORTING TYPEWRITERS WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	A Method for manufacturing a liquid discharge head having a flow path forming member for forming a liquid flow path which communicates with a discharge port discharging liquid, comprises; preparing a layer containing a compound having a structure represented by Formula (1) and a structure represented by Formula (2) as a main chain on a substrate, providing a solution in which a resin is dissolved in a compound represented by Formula (3) or (4) on the layer, forming a mold having the shape as the flow path from the resin, providing a layer which will become the flow path forming member so as to cover the mold, and removing the mold to form the flow path.