Recycling method and recycling apparatus of slurry for use in wafer polishing

A recycling method of slurry for use in wafer polishing for reusing slurry used in a polishing process of semiconductor wafer, comprises the steps of: adding a dispersant to a recovered used-slurry to inhibit aggregation of the slurry; breaking up aggregates in such a manner that the whole of the us...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser:	GOTOU ISAMU
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CRUSHING, PULVERISING, OR DISINTEGRATING CRUSHING, PULVERISING, OR DISINTEGRATING IN GENERAL DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING MILLING GRAIN PERFORMING OPERATIONS POLISHING PREPARATORY TREATMENT OF GRAIN FOR MILLING SEMICONDUCTOR DEVICES TRANSPORTING
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Beschreibung
Zusammenfassung:	A recycling method of slurry for use in wafer polishing for reusing slurry used in a polishing process of semiconductor wafer, comprises the steps of: adding a dispersant to a recovered used-slurry to inhibit aggregation of the slurry; breaking up aggregates in such a manner that the whole of the used slurry, subjected to the dispersant addition step, is passed through a shearing force imparting device to impart shearing force to the aggregates contained in the slurry by the shearing force imparting device, thereby breaking up the aggregates; and removing foreign substances in the slurry subjected to the aggregate breakup step, by means of a foreign substances removing device. According to the method, a large amount of used-slurry can be processed in a short time.