Semiconductor device and manufacturing method therefor

A multilayer wiring substrate has an upper surface with multiple bonding leads and a lower surface with multiple lands. Multiple wiring layers and insulating layers are alternately formed on the upper surface side and on the lower surface side of the core material of the wiring substrate. The bondin...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	OKADA MIKAKO, ISHIKAWA TOSHIKAZU
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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