Circuit board and structure using the same

According to one of the invention, a circuit board comprises a conductive layer. The conductive layer includes a first land portion, a second land portion apart from the first land portion in a plan view, and a line portion connecting the first land portion and the second land portion to each other....

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	ICHINOSE MANABU, NAKAMURA SATOSHI, YAMANAKA KIMIHIRO
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	According to one of the invention, a circuit board comprises a conductive layer. The conductive layer includes a first land portion, a second land portion apart from the first land portion in a plan view, and a line portion connecting the first land portion and the second land portion to each other. The line portion includes lead portions through which a current is to flow and an opening portion arranged between the lead portions. The opening portion penetrates the conductive layer in a thickness direction.