Package integrated soft magnetic film for improvement in on-chip inductor performance

Package integrated soft magnetic film for improvement in on-chip inductor performance

An integrated circuit package includes an integrated circuit with one or more on-chip inductors. A package cover covers the integrated circuit. A magnetic material is provided between the integrated circuit and the package cover. The magnetic material may be a soft magnetic thin film. The magnetic m...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: FENG KAI DI, LIU XUEFENG, COTTE JOHN MICHAEL, HOIVIK NILS D, DING HANYI, HE ZHONG-XIANG
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:An integrated circuit package includes an integrated circuit with one or more on-chip inductors. A package cover covers the integrated circuit. A magnetic material is provided between the integrated circuit and the package cover. The magnetic material may be a soft magnetic thin film. The magnetic material may be affixed to the package cover by an adhesive. The magnetic material may be formed directly on the package cover by one of deposition, sputtering or spraying. The magnetic material may be affixed to the integrated circuit.