Wafer level surface passivation of stackable integrated circuit chips

Wafer level surface passivation of stackable integrated circuit chips

An electrically insulative conformal coating is applied at least to the active (front) side and one or more sidewalls of the die during wafer processing. Also, a die has an electrically insulative conformal coating applied to at least the active (front) side and sidewalls. Also, assemblies include a...

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Hauptverfasser: MCELREA SIMON J. S, DU YONG, CASKEY TERRENCE, PAN WEIPING, VILLAVICENCIO GRANT, MELCHER DEANN EILEEN, CO REYNALDO, ANDREWS, JR. LAWRENCE DOUGLAS, CRANE SCOTT JAY, LIU ZONGRONG, MCGRATH SCOTT
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Sprache:eng
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BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator MCELREA SIMON J. S
DU YONG
CASKEY TERRENCE
PAN WEIPING
VILLAVICENCIO GRANT
MELCHER DEANN EILEEN
CO REYNALDO
ANDREWS, JR. LAWRENCE DOUGLAS
CRANE SCOTT JAY
LIU ZONGRONG
MCGRATH SCOTT
description An electrically insulative conformal coating is applied at least to the active (front) side and one or more sidewalls of the die during wafer processing. Also, a die has an electrically insulative conformal coating applied to at least the active (front) side and sidewalls. Also, assemblies include a stack of such die, electrically interconnected die-to-die; and assemblies include such a die or a stack of such die, electrically interconnected to underlying circuitry (for example in a substrate or a circuit board).
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Wafer level surface passivation of stackable integrated circuit chips
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