Package-on-package with fan-out WLCSP

Package-on-package with fan-out WLCSP

A package-on-package includes a package carrier; a semiconductor die assembled face-down to a chip side of the package carrier; a rewiring laminate structure between the semiconductor die and the package carrier; a plurality of bumps arranged on the rewiring laminate structure for electrically conne...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: HSU CHIH-TAI, CHEN NANNG
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A package-on-package includes a package carrier; a semiconductor die assembled face-down to a chip side of the package carrier; a rewiring laminate structure between the semiconductor die and the package carrier; a plurality of bumps arranged on the rewiring laminate structure for electrically connecting the semiconductor die with the package carrier; and an IC package mounted on the package carrier. The IC package and the semiconductor die are at least partially overlapped.