Sacrificial CMP etch stop layer

A chemical mechanical polishing (CMP) stop layer is implemented in a semiconductor fabrication process. The CMP stop layer, among other things, mitigates erosion of sidewall spacers during semiconductor fabrication and adverse effects associated therewith.

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Bibliographische Detailangaben
Hauptverfasser: PAS MICHAEL FRANCIS, RAMIN MANFRED
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:A chemical mechanical polishing (CMP) stop layer is implemented in a semiconductor fabrication process. The CMP stop layer, among other things, mitigates erosion of sidewall spacers during semiconductor fabrication and adverse effects associated therewith.