Integrated circuit arrangement including vias having two sections, and method for producing the same

Integrated circuit arrangement including vias having two sections, and method for producing the same

An integrated circuit arrangement containing a via is disclosed. The via has an upper section having greatly inclined sidewalls. A lower section of the via has approximately vertical sidewalls. In one embodiment, a liner layer is used as a hard mask in the production of the via and defines the posit...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: KRIZ JAKOB, GOLLER KLAUS
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:An integrated circuit arrangement containing a via is disclosed. The via has an upper section having greatly inclined sidewalls. A lower section of the via has approximately vertical sidewalls. In one embodiment, a liner layer is used as a hard mask in the production of the via and defines the position of the sections of the via.