Polyamides

Polyamide containing a compound which bears at least one hydroxy group and has chemical bonding by way of an amide group to the end of the polymer chain, process for preparing this polyamide, and also fibers, films, and moldings, comprising at least one such polyamide.

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Bibliographische Detailangaben
Hauptverfasser: WINTERLING HELMUT, DEMETER JUERGEN, KREMPEL KURT
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:Polyamide containing a compound which bears at least one hydroxy group and has chemical bonding by way of an amide group to the end of the polymer chain, process for preparing this polyamide, and also fibers, films, and moldings, comprising at least one such polyamide.