Piezoelectric component and manufacturing method thereof

An object of the present invention is to economically manufacture a piezoelectric component having superior molding pressure resistance and reduced height. The present invention comprising: a piezoelectric substrate with piezoelectric devices formed on a principle surface; a device wiring section formed on the principle surface; protective film having a terminal electrode connected to the wiring section formed on its upper surface; a rewiring layer on an upper surface of the protective film and connected to a wiring section of another electrode; an inorganic material-buffer layer covers an entire upper surface of the rewiring layer excluding the piezoelectric devices; a photosensitive film-outer periphery wall, formed on an upper surface of the buffer layer; a photosensitive film-first ceiling layer, having mica filler added thereto is formed on an upper surface of the outer periphery wall; an insulating material mesh-shaped member, installed on an upper surface of the first ceiling layer; a photosensitive resin film-second ceiling layer with mica filler added thereto covers an upper surface of the mesh-shaped member; and through electrodes that pass through the first and second ceiling layers, the outer periphery wall, and the mesh-shaped member, thus between the outer periphery wall, the first ceiling layer, and the principle surface of the piezoelectric substrate, there is a hollow that accommodates the piezoelectric devices.