Slider bond pad with a recessed channel
A slider includes a slider body and a bond pad. The bond pad is positioned on the slider body and has a bonding surface with a recessed channel for directing solder flow. Separately related, an assembly includes a suspension assembly including a suspension mounting surface and a suspension pad on th...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | A slider includes a slider body and a bond pad. The bond pad is positioned on the slider body and has a bonding surface with a recessed channel for directing solder flow. Separately related, an assembly includes a suspension assembly including a suspension mounting surface and a suspension pad on the suspension mounting surface. A slider is positioned adjacent the suspension mounting surface, with a slider pad aligned with the suspension pad. A recessed channel is in at least one of the slider pad or the suspension pad. A solder joint is formed between the suspension pad and the slider pad and extends into the recessed channel. |
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