Method and system for inspecting a diced wafer

A method for inspecting a diced object that comprises multiple dies, the method includes: acquiring multiple images of multiple portions of the diced object, starting from a first portion that comprises an alignment area and continuing through adjacent portions of the diced object; assigning a die index to each die of the multiple dies of the diced object, starting from a die of the first portion and continuing through adjacent portions of the diced object; associating between dies of the diced object and a dies of a reference object in response to the assigned indexes and locations of the dies of the diced object; wherein the reference object is not diced; and comparing between a die of the diced object and another die while taking into account an association between the die of the diced object and a reference object die.