Substrate device or package using embedded layer of voltage switchable dielectric material in a vertical switching configuration

A substrate device includes an embedded layer of VSD material that overlays a conductive element or layer to provide a ground. An electrode, connected to circuit elements that are to be protected, extends into the thickness of the substrate to make contact with the VSD layer. When the circuit elemen...

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Bibliographische Detailangaben
Hauptverfasser: KOSOWSKY LEX, GRAYDON BHRET, FLEMING ROBERT
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:A substrate device includes an embedded layer of VSD material that overlays a conductive element or layer to provide a ground. An electrode, connected to circuit elements that are to be protected, extends into the thickness of the substrate to make contact with the VSD layer. When the circuit elements are operated under normal voltages, the VSD layer is dielectric and not connected to ground. When a transient electrical event occurs on the circuit elements, the VSD layer switches instantly to a conductive state, so that the first electrode is connected to ground.