Method of manufacturing a semiconductor device having a semiconductor chip and resin sealing portion

A method of manufacturing a semiconductor device includes preparing a semiconductor chip having a main surface, forming a conductive portion made from a material having conductivity and malleability on the main surface, arranging the semiconductor chip within a die after the step of forming the conductive portion, the die having an inner surface facing the main surface with a spacing therebetween, and a protruding portion protruding from the inner surface to press the conductive portion, and forming a sealing resin portion having a surface and an opening by filling the die with a resin and then removing the die, the surface facing the main surface, the opening passing through between the conductive portion and the surface.