Apparatus to manufacture a semiconductor package having a buffer disposed adjacent to a process unit of the apparatus

Apparatus to manufacture a semiconductor package having a buffer disposed adjacent to a process unit of the apparatus

An apparatus to manufacture a semiconductor package is provided. A die attaching process and/or a wire bonding process for first and second surfaces of a lead frame are sequentially performed inside the apparatus. Thus, time required for a semiconductor packaging process decreases and yield is incre...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: RYU HWANG-BOK, PARK JAE YONG, SIN WHASU, KIM GOON WOO
Format: Patent
Sprache:eng
Schlagworte:
COMBINED OPERATIONS
MACHINE TOOLS
METAL-WORKING NOT OTHERWISE PROVIDED FOR
OTHER WORKING OF METAL
PERFORMING OPERATIONS
TRANSPORTING
UNIVERSAL MACHINE TOOLS
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Beschreibung
Zusammenfassung:An apparatus to manufacture a semiconductor package is provided. A die attaching process and/or a wire bonding process for first and second surfaces of a lead frame are sequentially performed inside the apparatus. Thus, time required for a semiconductor packaging process decreases and yield is increased.