Method for manufacturing semiconductor device

A method of manufacturing a semiconductor device includes forming a gate electrode, a source region and a drain region, forming a first metal layer, forming silicide layers by first annealing, removing a remainder of the first metal layer after the first annealing, performing a second annealing, for...

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Bibliographische Detailangaben
Hauptverfasser: AKIYAMA SHINICHI, MORISAKI YUSUKE, OKUBO KAZUYA, MOMIYAMA YOUICHI
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:A method of manufacturing a semiconductor device includes forming a gate electrode, a source region and a drain region, forming a first metal layer, forming silicide layers by first annealing, removing a remainder of the first metal layer after the first annealing, performing a second annealing, forming a second metal layer, performing a third annealing, and removing a remainder of the second metal layer.