Method for coating a multilayer film and product having a multilayer coated film

The invention provides a method of applying a mutilayer coating film, in which two or more layers of coating are applied to a flat plate, such as steel plate; and a product with multilayer coating film obtained by the method. The method includes discharging paint films through multiple slits, simult...

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Bibliographische Detailangaben
Hauptverfasser:	TOBISAWA KATSUNORI, SUEMUNE YOSHIHIRO, NAGASE MAGONORI, FURUKAWA HIROYASU
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM PERFORMING OPERATIONS PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL SPRAYING OR ATOMISING IN GENERAL TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS TRANSPORTING
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Beschreibung
Zusammenfassung:	The invention provides a method of applying a mutilayer coating film, in which two or more layers of coating are applied to a flat plate, such as steel plate; and a product with multilayer coating film obtained by the method. The method includes discharging paint films through multiple slits, simultaneously applying these films to a traveling plate to thereby form a multilayer paint film and carrying out drying or baking thereof, characterized in that the boiling point of the solvent contained in the layer close to the plate is equivalent to or lower than the boiling point of solvent contained in the layer remote from the plate, and that the boiling point of solvent contained in the layer closest to the plate is lower than the boiling point of solvent contained in the layer remotest from the plate.